General Micro Electronics, Incorporated- Semiconductor Assembly Process Harvard Case Solution & Analysis

Introduction

General Micro Electronics (GME) designs and supplies a number of different analogs, mixed signal and digital semi-conductors that are used for communication application support. The company initiated its business in UK and has it’s headquarter in UK as well, but now it is operating in Germany, U.S.A and Singapore as well. General Micro Electronics covers 4 segments that include wire-line telecommunication, wireless, networking and memory management.

The company purchased a new machine in January to support the growing demand of its assembly business. In the initial months, the new machine performed well and produced the desired output, but with time, the performance of the machine became questionable as it was no longer meeting the requirements and specifications. In semiconductor chips, the strength of the wire-bond plays a very critical role. The former wire-bonds were almost utilized to their fullest and now the company badly needed the new machine to start performing up to the mark. Because of this, the employees in the operation department were trying different combinations to find the best optimal combination of different factors like time and power, which would produce the output that would fulfil the specifications as well.

Analysis

Question No. 1: Statistical Process Chart Diagram

In this question, we are asked to develop a Statistical Process Chart Diagram, for this diagram, we need to know the sample mean and sample range of the data. The data is provided in the Exhibit 5 of the case study. The time frame of the new machine is 4 months up till now and the technicians of the company select one of the six dies for one time each day on the lead frame from the production lot. Moreover, on the second day, the technicians randomly select the two wires for each side of the die that was selected previously. Next, to complete the test, two wires are selected out of six for both sides of the die. Overall this gives us a total of eight observations for a single day.

General Micro Electronics, Incorporated- Semiconductor Assembly Process Harvard Case Solution & Analysis

Total 4 sides x 2 wires for each side = 8 observations per day

Therefore, we have taken n as 8.

To calculate the mean, we have simply used the AVERAGE function in excel and to calculate the range, we have first computed the maximum and minimum value for each sample and then we have obtained the range by subtracting minimum value from the maximum value. The graph obtained is shown in exhibit 1.

From the graph obtained, it can be analyzed that all the breaks of the wire-bond occurred at the bond to the lead frame. Moreover, analyzing the trend of range and mean of the sample data, there is a big possibility that the performance of this new machine is going to worsen even further. It looks impossible at this point in time that the machine would be able to meet the requirement of the company, i.e. pull strength should be greater than 7 grams.

Exhibit 5 clearly shows us that the process has worsened over the 4 month period. The total observations taken during this period are one thousand and eight, and out of these, eighty observations are below the required standard of 7 grams............

This is just a sample partical work. Please place the order on the website to get your own originally done case solution.

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