General Micro Electronics Incorporated:Semiconductor Assembly Process Harvard Case Solution & Analysis

General Micro Electronics Incorporated:Semiconductor Assembly Process Case Solution

Introduction

General Micro Electronics has the business of wireless,wire line telecommunications,memory management and networking. The sales generated by the wireless business accounts for 45% total business of the General Micro Electronics. Moreover, memory management contributed to 36% and remaining by the other businesses. The General Micro Electronic has experienced with its new machine of wire–bonder. It was in working from January and firmly proceeded to the February and was helpful in attaining the full capacity of it. However, the productivity of wire–bond became inconsistent and it was going worst day by day. Hence, the process engineer of General Micro Electronic,Brianna Regan,had to sort out the issue. Furthermore, Regan has discussed the issue with her managers. The suggestion for the Designing of Experiment has further revealed in order to resolve the problem with wire–bonder machine.There was a need for the immediate solution of the problem.

Answer to Question 1

Interpretation of SPC Diagram

The data sample shows the performance of the wire–bonder machine for4 months.A total of 126 samples were examined. Moreover, the observations are of 8 numbers of samples per day obtained through pull strength (4x2=8). Among 8 observations the defects in the product have been found. The sampling data further depicts that from the production lot the observer selects one die from the 6 dies one time everyday on first lead time.Onthe next step, the observer selects two wires randomly at each side of the die that has before selected once. The sides of the dies thus, were further selected for testing two wires of the six and as a result,an observation was complete by using both sides of the dies.

Answer to Question 2

Production Capability

The defects generated by Wire- bonder machine were significant to the production. The total numbers of observations were 1,008 from which 80 were below the standard of 7 gram (Exhibit 1).

Hence,

80/1008 = 0.07936

Hence, in percentage the rate of defect is 7.94%

Moreover,

Capacity = µ - Lower Specification Limit (LSL) / 3 ợ

Hence,

Capacity = 8 –0.07936/3 = 2.640

Since the significance level for determining the capacity level is 1 and the value is 2.640 (greater than 1), hence, the capacity level is not capable of standardized defect rates.

For the one million,a rate of defects by the six sigma is 99.99966% whichis equivalent to approximately 3.4 defects. Since the defects rate of General Micro Electronics is approximately 7.94%hence, the process is currently not included defects near six sigma rates of detects.

Answer to Question 3

The wire–bonder machine had to perform appropriately in order to produce effective number of units on the daily basis. General Micro Electronics had to utilize the full capacity of its all machines. Moreover, the efficiency of machine was required to perform over time aligned with all other machines.

Interpretation of Experimental Design

The meeting held with the directors of the company suggested the process of DOE Designing of Experiment method in order to assess the process of working of the machine. The Designing of Experiments depicted that there are 4 factors that have found appropriate to analyze. Through the Designing of Experiments process,evaluation of the capabilities and critics of running wire – bonded machine could be made possible...................

This is just a sample partial case solution. Please place the order on the website to order your own originally done case solution

General Micro Electronics Incorporated:Semiconductor Assembly Process Case Solution Other Similar Case Solutions like

General Micro Electronics Incorporated:Semiconductor Assembly Process

Share This